The US chip manufacturer Qualcomm is obviously already working on the successor to its current Snapdragon 660, which is used mainly in smartphones of the upper middle class.The new Qualcomm Snapdragon 670 will obviously be used in the same category again, as shown now by the details of a test platform of the manufacturer.

Snapdragon 670

The Snapdragon 670 is expected to make its debut in the course of the year 2018, although this may take a few months, after all, the current predecessor models Snapdragon 630 and Snapdragon 660 came on the market until the second half of 2017. Presumably, the new chip will come up with slightly higher clock speeds and enhanced multimedia capabilities.
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Also, a shrinkage of the manufacturing process on the 10-nanometer scale is considered possible, which also speaks of the fact that the chip apparently from the Korean electronics giant Samsung in its production facilities off the line and not like the previous models at TSMC in Taiwan. One indication is that the test platform now shipped in an import-export database was shipped with the chip from Qualcomm’s Korean office.

Specifically, runs the test platform, with the device manufacturers and Qualcomm itself mostly make adjustments to Android and the necessity for the operation of a smartphone software, with a display of unknown size, which offers a WQHD resolution and thus provides 2560×1440 pixels. In addition, there are several variants of the test platform in which either four or even six gigabyte ofLPDDR4X memory are installed.

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In addition, developers called the Development Testing Platform (DTP) also have 64 GB of eMMC 5.1-based memory, placing them clearly in the middle class. Most expensive devices today use mostly UFS memory, which offers considerably higher transmission rates. In addition, the Qualcomm development platform for the Snapdragon 670 also has a main camera with a resolution of 22.6 megapixels as well as a 13-megapixel front camera on board.

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