Also, a shrinkage of the manufacturing process on the 10-nanometer scale is considered possible, which also speaks of the fact that the chip apparently from the Korean electronics giant Samsung in its production facilities off the line and not like the previous models at TSMC in Taiwan. One indication is that the test platform now shipped in an import-export database was shipped with the chip from Qualcomm’s Korean office.
Specifically, runs the test platform, with the device manufacturers and Qualcomm itself mostly make adjustments to Android and the necessity for the operation of a smartphone software, with a display of unknown size, which offers a WQHD resolution and thus provides 2560×1440 pixels. In addition, there are several variants of the test platform in which either four or even six gigabyte ofLPDDR4X memory are installed.
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In addition, developers called the Development Testing Platform (DTP) also have 64 GB of eMMC 5.1-based memory, placing them clearly in the middle class. Most expensive devices today use mostly UFS memory, which offers considerably higher transmission rates. In addition, the Qualcomm development platform for the Snapdragon 670 also has a main camera with a resolution of 22.6 megapixels as well as a 13-megapixel front camera on board.