The US chipmaker Qualcomm intends to expand in 2018 next to the Snapdragon 845 top SoC also for devices of the premium and “normal” middle class designed lineup on ARM processors vigorously.For the first time in quite some time now, they have been using computing cores, each of which adapts the ARM-specified design to a certain degree.

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The Chinese micro-blogging network Weibo has now released a spreadsheet purporting to provide accurate details about the new Qualcomm SoCs. Specifically, it names the Qualcomm Snapdragon 670, the Snapdragon 640 and the Snapdragon 460, each with a series of upgrades over their predecessor chips to score. The basis is the new ARM Cortex-A55 and Cortex-A75 architectures, which Qualcomm optimizes and adapts to its own specifications.
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If chips like the Snapdragon 630/635 or the Snapdragon 450 are still set to unchanged cores based on the ARM-supplied architectures, Qualcomm now wants to make major changes. Of course, Qualcomm’s own LTE modems of the Snapdragon X16 or Snapdragon X12 type will be used again, which should provide downstream speeds of up to 1000 Mbps or 600 Mbps.

According to the leak, the Qualcomm Snapdragon 670 (SDM670) will be a scaled-down version of the recently introduced Snapdragon 845. Like the latter, the new mid-range device will have four so-called Cryo 385 Silver Cores, a derivative of the ARM Cortex-A55 architecture are and with up to 1.6 gigahertz above all to work particularly energy-efficient. In addition, there are four so-called Cryo 360 Gold Cores derived from the Cortex-A75 architecture, which reach up to 2.0 gigahertz and are always active when more power is needed.

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The GPU is the Qualcomm Adreno 620, although no information has been provided on its clock speed. For the cameras, the Spectra 260 ISP should provide support for a single camera with a maximum resolution of 26 megapixels. Alternatively, two image sensors with 13 megapixels each can be installed. The Snapdragon X16 modem delivers downstream speeds of up to a gigabit. The move to 110-nanometer scale manufacturing will also open new opportunities for the Snapdragon 670 in terms of energy efficiency.

Also Read: Qualcomm Snapdragon 845 Has Been Launched!

The Qualcomm Snapdragon 640 (SDM640) is likely to encounter us, especially in somewhat cheaper devices, if you can believe the leaked table. It is also an Octacore SoC, also manufactured on a 10 nanometer scale, but only two of the Kryo 360 Gold Cores will be used based on an adapted ARM Cortex-A75 architecture and will work with up to 2.15 gigahertz , In addition to the two high-end cores, the chip instead uses six so-called Kryo 360 Silver Cores.

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Although these are also derived from the ARM Cortex-A55 architecture, but run at 1.55 GHz slightly slower than their relatives on the SDM670 and have to make do with a halved to 64 kilobytes L2 cache. The Graifke unit is here an Adreno 610, while in terms of image processing the same key data is offered. The LTE modem is here of the type Snapdragon X12 and reaches “only” up to 600 MBit / s in the downstream and maximally 150 MBit / s in the upstream.

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Getting started with Qualcomm’s new SoC lineup for mobile devices is the Snapdragon 460 (SDM460). Unlike the other chips, this one is not yet manufactured with a 10 nanometer structure width, but runs off the conveyor belt on a 14-nanometer scale. Again, there are again eight cores in use, all of which are of the type Kryo 360 Silver and thus use a derived from the ARM Cortex-A55 architecture semi-custom design, it is said.

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Four of the ARM cores run at up to 1.4 gigahertz while the other four are allowed to clock up to 1.8 gigahertz if more power is needed. The GPU comes with the Adreno 605, which we do not know yet. The Snapdragon 460’s Spectra 240 ISP allows cameras up to 21 megapixels while the Snapdragon X12 modem can reach up to 600Mbps.

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When the first devices with the new Qualcomm Snapdragon SoCs are to be expected, is still unclear. They are likely to be presented for the first time during the Mobile World Congress2018, but it would also be possible to launch CES 2018 at the beginning of January 2018. 

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